Vapor chamber and manufacturing method of the same
AssigneeCooler Master Co., Ltd.
InventorChi-Lung Chen
Life of this patent
Estimating the term…
Abstract
A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
Claims10
A heat dissipating device, comprising:
- a second casing coupled to a first casing, the first casing including a recessed portion, wherein
- the recessed portion at least partially defines an evaporator section of the heat dissipating device,
- a condenser section of the heat dissipating device is disposed surrounding the recessed portion,
- the first casing and the second casing enclose an internal space of the heat dissipating device,
- a plurality of first support structures are arranged in the recessed portion,
- a plurality of second support structures are arranged in the condenser section, and
- a plurality of heat transfer structures are arranged in the recessed portion,
- wherein at least one first support structure of the plurality of first support structures is arranged on at least one heat transfer structure of the plurality of heat transfer structures, and
- wherein the plurality of heat transfer structures are arranged in parallel and extending away in order of increasing lengths from a central portion of the recessed portion.
Dependencies are inferred from the claim text.