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US 11,634,989 B2Granted
Methods and assemblies for bonding airfoil components together
AssigneeRaytheon Technologies Corporation
InventorsDaniel A. Bales, Brian T. Hazel, Thomas DeMichael
Life of this patent
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Abstract
During a bonding process, a tip cap and an airfoil base are provided. The tip cap is arranged on the airfoil base. The tip cap is diffusion bonded to the airfoil base.
Claims6
A bonding process, comprising:
- providing a tip cap and an airfoil base;
- arranging the tip cap on the airfoil base;
- diffusion bonding the tip cap to the airfoil base;
- heating at least an interface between the tip cap and the airfoil base during the diffusion bonding using a heating element, wherein the heating element is adjacent and extends around the interface;
- and
- cooling a component abutted against the tip cap during the diffusion bonding.
3 more elements
Dependencies are inferred from the claim text.