Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film

A method for manufacturing a semiconductor device, the method comprising:

• a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa·s or higher at 120° C., a tacky adhesive layer, and a base material film in this order;
• a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together;
• a step of dicing the semiconductor wafer;
• a step of expanding the base material film and thereby dividing the semiconductor wafer and the adhesive layer into individual pieces, to obtain an adhesive-attached semiconductor element formed of the individual piece;
• a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer;
• a step of laminating the adhesive-attached semiconductor element to another semiconductor element, with an adhesive of the adhesive-attached semiconductor element interposed therebetween;
• and
• a step of heat-curing the adhesive.