Back to results
US 11,634,596 B2Granted
Metal powder sintering paste and method of producing the same, and method of producing conductive material
AssigneeNichia Corporation
InventorsTeppei Kunimune, Masafumi Kuramoto
Life of this patent
Estimating the term…
Abstract
There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.
Claims9
A metal powder sintering paste,
- the paste comprising, as a principal component, silver particles having a median diameter of 0.3 μm to 5 μm, and
- further comprising an anionic surfactant, and
- being substantially free from resin,
- wherein
- in the silver particles, a content of particles with a particle diameter of smaller than 0.3 μm is not more than 5% by mass,
- wherein
- a content of the surfactant is not more than 2% by mass with respect to the paste, and
- wherein
- the surfactant is a saturated carboxylic acid represented by Formula (I) below:
- R1O(CH2CH(R2)O)n1CH2COOR3 (I)
- wherein R1 is a linear or branched alkyl group having at least 7 carbon atoms,
- R2 is any one of —H, —CH3, —CH2CH3, and —CH2CH2CH3,
- R3 is —H or alkali metal, and
- n1 is in a range of 2 to 5.
11 more elements
Dependencies are inferred from the claim text.