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US 11,634,581 B2Granted
Thermally conductive resin composition and thermally conductive sheet using the same
AssigneeDexerials Corporation
InventorMasayuki Matsushima
Life of this patent
Estimating the term…
Abstract
A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.
Claims16
A thermally conductive resin composition containing:
- an addition reaction type silicone resin;
- a hindered phenol-based antioxidant;
- a sulfur-based antioxidant;
- a dispersant having a hydrophilic functional group and a silicone chain;
- and
- a thermally conductive filler,
- wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler,
- wherein the thermally conductive filler is a mixture of aluminum nitride, alumina, and magnesium oxide, and
- wherein the composition contains 0.6 to 0.7 parts by weight of the hindered phenol-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, 0.3 to 1.9 parts by weight of the sulfur-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, and 9.3 to 23.8 parts by weight of the dispersant having a hydrophilic functional group and a silicone chain with respect to 100 parts by weight of the addition reaction type silicone resin.
6 more elements
A thermally conductive resin composition containing:
- an addition reaction type silicone resin;
- a hindered phenol-based antioxidant;
- a sulfur-based antioxidant;
- a dispersant having a hydrophilic functional group and a silicone chain;
- and
- a thermally conductive filler,
- wherein the thermally conductive resin composition exhibits a thermal conductivity of 2.5 W/m*K or more after curing,
- wherein the thermally conductive filler is a mixture of aluminum nitride, alumina, and magnesium oxide, and
- wherein the composition contains 0.6 to 0.7 parts by weight of the hindered phenol-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, 0.3 to 1.9 parts by weight of the sulfur-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, and 9.3 to 23.8 parts by weight of the dispersant having a hydrophilic functional group and a silicone chain with respect to 100 parts by weight of the addition reaction type silicone resin.
6 more elements
Dependencies are inferred from the claim text.