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US 11,634,529 B2Granted
Multilayer structure
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsSanjay Malik, William A. Reinerth
Life of this patent
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Abstract
This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.
Claims16
A multilayer structure, comprising:
- a substrate;
- a coupling layer deposited on the substrate, the coupling layer comprising at least one (meth)acrylate polymer, at least one cross-linker, and at least one initiator capable of inducing a cross-linking reaction;
- and
- a dielectric layer deposited on the coupling layer, the dielectric layer comprising at least one fully imidized polyimide polymer, at least one cross-linker, and at least one initiator capable of inducing a cross-linking reaction;
- wherein shear strength of the dielectric layer is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer structure without the coupling layer.
2 more elements
A multilayer structure, comprising:
- a substrate;
- a cross-linked coupling layer deposited on the substrate, the coupling layer comprising at least one (meth)acrylate polymer;
- and
- a cross-linked dielectric layer deposited on the coupling layer, the dielectric layer comprising at least one fully imidized polyimide polymer;
- wherein shear strength of the dielectric layer is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer structure without the coupling layer.
2 more elements
Dependencies are inferred from the claim text.