Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsRongtao Wang, Chenyu Shen, Yan Zhang, Xing He
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Abstract
A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
Claims15
A resin composition, based on 100 parts by weight of a polyolefin, comprising:
- (A) 100 parts by weight of the polyolefin;
- and
- (B) 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1),
- wherein R is a functional group containing an unsaturated C═C double bond;
- and
- wherein the polyolefin comprises polybutadiene, polyisoprene, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl-polybutadiene-urethane oligomer, maleic anhydride-butadiene copolymer, polymethylstyrene, styrene-maleic anhydride copolymer, hydrogenated polybutadiene, hydrogenated styrene-butadiene-divinylbenzene terpolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer or a combination thereof.
Dependencies are inferred from the claim text.