Back to results
US 11,634,356 B2Granted
Glass and melt solder for the passivation of semiconductor components
AssigneeSchott AG
InventorsLinda Johanna Bartelt, Antonio Trizzino, Julia Gold, Sabine Pichler-Wilhelm, Martin Letz, Martun Hovhannisyan
Life of this patent
Estimating the term…
Abstract
The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
Claims18
A melt solder with the following constituents in % by mole:
- SiO2
- 15.0 to 30.0
- Al2O3
- 0.5 to 8.0
- B2O3
- 14.0 to 25.0
- ZnO
- 40.0 to 65.0
- MgO
- 0.1 to 8.0
- wherein the solder comprises a crystalline additive, wherein the crystalline additive contains magnesium and aluminum, and wherein the crystalline additive is present in an amount of at least 1.0% by volume of the solder.
8 more elements
Dependencies are inferred from the claim text.