Low-particle gas enclosure systems and methods
AssigneeKateeva, Inc.
InventorsJustin Mauck, Alexander Sou-Kang Ko, Eliyahu Vronsky, Shandon Alderson, Alexey Stepanov
Life of this patent
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Abstract
A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
Claims23
A method of processing of a substrate, the method comprising:
- depositing organic material from a printhead onto a substrate positioned in a gas enclosure enclosing a printing system comprising the printhead;
- while depositing the organic material:
- circulating gas along a circulation path in the gas enclosure;
- flowing the gas along the circulation path past the printhead and through a first housing located in the gas enclosure, the first housing containing a service bundle operably coupled to the printing system, wherein the circulation path includes a first portion configured to flow the gas through a second housing containing the printhead and through the first housing containing the service bundle, and the substrate is located outside of the second housing containing the printhead and the first housing containing the service bundle;
- and
- filtering particulate matter from the gas flowed through the housing containing the service bundle.
A method of controlling an environment during processing of a substrate, the method comprising:
- processing a substrate in a gas enclosure to form a film on one or more portions of the substrate;
- while processing the substrate, circulating gas along a circulation path through the gas enclosure, the circulating the gas along the circulation path comprising:
- flowing the gas from a region between the substrate and to an exhaust housing enclosing a printhead assembly housed in the gas enclosure, and
- flowing the gas through the exhaust housing, wherein the substrate is located outside of the exhaust housing;
- and
- filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
Dependencies are inferred from the claim text.