System and method for improving thermoset-thermoplastic interface adhesion
AssigneeThe Boeing Company
InventorsNishant Kumar Sinha, Om Prakash
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AssigneeThe Boeing Company
InventorsNishant Kumar Sinha, Om Prakash
Estimating the term…
Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surface—thereby providing improved attachment of additional thermoplastic components to the thermoset substrate.
A method for joining components, the method comprising:
A method for improving interface strength between joined parts, the method comprising:
A method for joining components, the method comprising:
Dependencies are inferred from the claim text.