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US 11,633,815 B2Granted
Solder paste
AssigneeSenju Metal Industry Co., Ltd.
InventorsToru Hayashida, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei
Life of this patent
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Abstract
Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
Claims7
A solder paste in which change in viscosity over time is suppressed, the solder paste comprising:
- a mixture of a solder powder containing 42 mass % or more of Sn, a zirconium oxide powder, and a flux, the zirconium oxide powder being present in the mixture independent from the solder powder,
- wherein the solder paste contains 0.05 to 20.0% by mass of zirconium oxide powder with respect to the total mass of the solder paste;
- and
- the solder powder consists of:
- Sn;
- or
- Sn and at least one or more selected from a group consisting of Ag, Cu, Bi, Sb, Pb, Zn, Al, Co, Mn, Fe, Ge, Ga, P, Au, Pt, and Zr.
4 more elements
Dependencies are inferred from the claim text.