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US 11,633,702 B2Granted
Solder paste on demand apparatus
AssigneeSAFI-Tech, Inc.
InventorsMartin Thuo, Ian Tevis, Darin Heisterkamp
Life of this patent
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AssigneeSAFI-Tech, Inc.
InventorsMartin Thuo, Ian Tevis, Darin Heisterkamp
Estimating the term…
A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.
A system for the manufacture of solder paste, comprising a reconstitution assembly;
A method for the manufacture of solder paste, comprising:
A method for the manufacture of solder paste, comprising:
Dependencies are inferred from the claim text.