Feedthrough assembly and device including same

An electronics module comprising:

• an electronic layer comprising a substrate and an electronic component disposed on the substrate;
• and
• a feedthrough header assembly electrically connected to the electronic layer, wherein the feedthrough header assembly comprises:
• a header comprising an inner surface and an outer surface;
• a dielectric substrate comprising a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header;
• a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer comprises a first conductive portion and a second conductive portion electrically isolated from the first conductive portion;
• a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header, wherein the feedthrough pin extends beyond the outer surface of the header.

An implantable medical device comprising:

• a power source;
• and
• an electronics module electrically connected to the power source and comprising an electronic layer and a feedthrough header assembly electrically connected to the electronic layer, wherein the electronic layer comprises a substrate and an electronic component disposed on the substrate, and further wherein the feedthrough header assembly comprises:
• a header comprising an inner surface and an outer surface;
• a dielectric substrate comprising a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header;
• a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer comprises a first conductive portion and a second conductive portion electrically isolated from the first conductive portion;
• and
• a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header, wherein the feedthrough pin extends beyond the outer surface of the header.