Loading patent…
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
Estimating the term…
A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.
A RF semiconductor device heat-sinking waveguide comprising:
A RF semiconductor device heat-sinking waveguide comprising:
A RF semiconductor device heat-sinking waveguide comprising:
Dependencies are inferred from the claim text.