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US 11,630,169 B1Granted
Fabricating a coil above and below a magnetoresistance element
AssigneeAllegro MicroSystems, LLC
InventorsYen Ting Liu, Maxim Klebanov, Paolo Campiglio, Sundar Chetlur, Harianto Wong
Life of this patent
Estimating the term…
Abstract
In one aspect, a method includes forming a metal layer on a substrate, wherein the metal layer comprises a first coil, forming a planarized insulator layer on the metal layer, forming at least one via in the planarized insulator layer, depositing a magnetoresistance (MR) element on the planarized insulator layer, and forming a second coil extending above the MR element. The at least one via electrically connects to the metal layer on one end and to MR element on the other end.
Claims22
A method, comprising:
- forming a metal layer on a substrate, wherein the metal layer comprises a first coil;
- forming a planarized insulator layer on the metal layer,
- forming at least one via in the planarized insulator layer;
- depositing a magnetoresistance (MR) element on the planarized insulator layer, wherein the at least one via electrically connects to the metal layer on one end and to MR element on the other end;
- and
- forming a second coil extending above the MR element.
3 more elements
A magnetic field sensor, comprising:
- a substrate;
- a metal layer on the substrate and comprising a first coil;
- a planarized insulator layer on the metal layer;
- a magnetoresistance (MR) element on the planarized insulator layer;
- at least one via in the planarized insulator layer that electrically connects to the metal layer on one end and to the MR element at the other end;
- and
- a second coil extending above the MR element.
4 more elements
Dependencies are inferred from the claim text.