Sensor system and method

A method comprising:

• depositing an inlay in a recess defined within a surface of a structure, wherein the inlay is a different material than a material of the structure surrounding the inlay;
• disposing a structure bonding layer on an outer surface of the inlay, wherein the structure bonding layer is a metallic alloy;
• disposing a sensor bonding layer on a surface of a non-metallic wafer of a sensor, wherein the sensor bonding layer is a metallic alloy;
• and
• coupling the structure bonding layer to the sensor bonding layer via a metallic joint, wherein:
• the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer;
• and
• the inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.

A structure comprising:

• a curved surface;
• a sensor including a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy;
• an inlay disposed on the curved surface of the structure, wherein the inlay comprises a planar outer surface;
• and
• a structure bonding layer disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy, wherein:
• the sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer;
• and
• the inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.