Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects
AssigneeCorning Incorporated
InventorsRobert Alan Bellman, Jeffrey Stapleton King, Scott Christopher Pollard
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Abstract
A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.
Claims19
A method of forming a glass electrochemical sensor, comprising:
- forming a plurality of electrode through glass vias (TGVs) in a glass substrate;
- depositing an electrode material in the at least one of the plurality of electrode TGVs;
- hermetically sealing the electrode material in the at least one of the plurality of electrode TGVs with the glass substrate;
- forming a cavity in a first glass layer;
- forming an electrode on a bottom surface of the glass substrate adjacent to the at least one of the plurality of electrode TGVs such that the electrode is positioned within the cavity;
- and
- electrically connecting the electrode to a top surface of the glass substrate through the electrode material in the at least one of the plurality of electrode TGVs.
A method of forming a glass electrochemical sensor, comprising:
- forming a plurality of electrode through glass vias (TGVs) in a glass substrate;
- depositing an electrode material in the at least one of the plurality of electrode TGVs:
- hermetically sealing the electrode material in the at least one of the plurality of electrode TGVs with the glass substrate;
- forming an electrode on a bottom surface of the glass substrate adjacent to the at least one of the plurality of electrode TGVs;
- and
- electrically connecting the electrode to a top surface of the glass substrate through the electrode material in the at least one of the plurality of electrode TGVs;
- and further comprising:
- forming a cavity in a first glass layer;
- and
- bonding a first side of the first glass layer to the bottom surface of the glass substrate such that the electrode is positioned within the cavity.
Dependencies are inferred from the claim text.