Semiconductor device

A semiconductor device, detachably mountable on a measurement target that includes a cylinder section, a disk section, a plurality of sensors and a plurality of sensor terminals fixed to a predetermined surface thereof, respectively, the semiconductor device comprising:

• a wiring board having a first surface, and a second surface opposite to the first surface;
• a semiconductor integrated circuit, mounted on the first surface of the wiring board, and configured to perform a computation based on signals received from the plurality of sensors;
• a plurality of measuring spring terminals mounted on the second surface of the wiring board at positions point symmetrical with respect to a center of the wiring board;
• and
• a plurality of projections provided on the second surface of the wiring board, wherein the positions of the plurality of measuring spring terminals on the second surface of the wiring board are located on an imaginary circle having a center coinciding with the center of the wiring board, in a state where the semiconductor device is mounted on the measurement target so that the predetermined surface of the measurement target opposes the second surface of the wiring board, each of the plurality of measuring spring terminals makes contact with a corresponding one of the plurality of sensor terminals electrically connected to a corresponding one of the plurality of sensors, so as to electrically connect to the corresponding one of the plurality of sensors, each of the plurality of projections makes contact with the measurement target, and the semiconductor integrated circuit performs the computation based on the signals received from the plurality of sensors via the plurality of sensor terminals and the plurality of measuring spring terminals.