Flow sensor, method for manufacturing flow sensor and flow sensor module
AssigneeHitachi Astemo, Ltd.
InventorsTsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
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Abstract
A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.
Claims5
A flow sensor comprising:
- a semiconductor device having an air flow sensing unit and a diaphragm formed thereto;
- an electric control circuit configured to control the semiconductor device;
- a lead frame;
- and
- a spacer, wherein
- the spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween,
- a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed,
- at the joint portion, the semiconductor device is attached to the lead frame via an adhesive, and
- the spacer is formed of polytetrafluoroethylene, a fluorine resin, an epoxy resin, or a polycarbonate resin.
A method for manufacturing a flow sensor from a structure, comprising:
- disposing an elastic film on a surface of an upper mold of the molds, wherein the structure includes
- a semiconductor device having an air flow sensing unit and a diaphragm formed thereto,
- an electric control circuit for controlling the semiconductor device,
- a lead frame, and
- a spacer, wherein
- the spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed there between, and
- at the joint portion, the semiconductor device is attached to the lead frame via an adhesive;
- clamping a dam of the lead frame via the molds with varying a thickness of the elastic film for absorbing a dimension variation of the semiconductor device;
- molding the structure;
- and
- cutting away the dam excluding output terminals of the lead frame.
Dependencies are inferred from the claim text.