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US 11,629,891 B2Granted
Heat pump system
AssigneeSamsung Electronics Co., Ltd.
InventorsMasaki Saito, Takeshi Takahara, Kimio Koda, Kazushige Tajima
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Abstract
The present disclosure relates to a heat pump system comprising an outdoor unit disposed in an outdoor space, a plurality of thermal load units supplied with cool air and hot air, and an intermediate unit disposed between the outdoor unit and the plurality of thermal load units, wherein the intermediate unit is connected to the outdoor unit through refrigerant pipes and connected to the plurality of thermal load units through thermal medium pipes.
Claims13
A heat pump system comprising
- an outdoor unit disposed in an outdoor space, the outdoor unit comprising a four-way valve and an outdoor heat exchanger;
- a plurality of thermal load units supplied with cool air and hot air;
- and
- an intermediate unit disposed between the outdoor unit and the plurality of thermal load units,
- wherein the intermediate unit is connected to the outdoor unit through refrigerant pipes through which a refrigerant passes, and connected to the plurality of thermal load units through thermal medium pipes through which a thermal medium passes, and
- wherein the refrigerant pipes comprise:
- a first refrigerant pipe to guide the refrigerant from the four-way valve to the outdoor heat exchanger,
- a second refrigerant pipe to guide the refrigerant from the four-way valve to a heating heat exchanger,
- a third refrigerant pipe to connect the first refrigerant pipe and the second refrigerant pipe, and
- an on-off valve disposed on the third refrigerant pipe to allow the refrigerant to selectively flow through the third refrigerant pipe.
7 more elements
Dependencies are inferred from the claim text.