Fabrication process using vapour deposition through a positioned shadow mask

A method of fabricating at least part of a device in a vacuum chamber, the method comprising:

• deploying a wafer within the vacuum chamber;
• applying a mask in a first position over the wafer in the vacuum chamber;
• following the application of the mask, with the mask in the first position, performing a first fabrication step comprising projecting material onto the wafer through patterned openings in the mask while in vacuum in the vacuum chamber;
• following the first fabrication step, operating a mask-handling mechanism deployed within the vacuum chamber in order to reposition the mask to a second position while remaining in vacuum in the vacuum chamber, wherein the repositioning comprises receiving readings from one or more sensors sensing a current position of the mask and based thereon aligning the current position of the mask to the second position;
• and
• following said repositioning, with the mask now in the second position, performing a second fabrication step comprising projecting material onto the wafer through patterned openings in the repositioned mask while still maintaining the vacuum in the vacuum chamber.