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US 11,629,426 B1Granted
Silver electroplating compositions and methods for electroplating rough matt silver
AssigneeRohm and Haas Electronic Materials LLC
InventorsFai Lung Ting, Weigang Wu
Life of this patent
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Abstract
Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.
Claims14
A silver electroplating composition comprising silver ions, a conductivity compound and a compound having a formula:
- wherein R1 is hydrogen or C1-C4 alkyl and R2 is C1-C4 alkyl or phenyl.
Dependencies are inferred from the claim text.