Method and apparatus for uniformly metallization on substrate
AssigneeACM Research (Shanghai) Inc.
InventorsHui Wang, Fuping Chen, Xi Wang
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Abstract
The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.
Claims19
An apparatus for substrate metallization from electrodeless electrolyte comprising:
- an immersion bath containing metal salt electrolyte;
- a substrate holder for holding at least one substrate;
- at least one sonic device coupled with a reflection plate for forming an ultra or mega sonic standing wave area in the immersion bath;
- a first oscillating actuator configured for oscillating the substrate holder along its axis for making the substrate holder pass through the entire ultra or mega sonic standing wave area, so as to result in a uniform power intensity distribution across the substrate held by the substrate holder over an accumulated time;
- an adjusting mechanism includes an actuator for oscillating the reflection plate or the ultra or mega sonic device along the propagating direction of the ultra or mega sonic standing wave, wherein the oscillation amplitude is equal to N times of half wave length of the ultra or mega sonic standing wave, and N is an integer number from 1 to 10.
Dependencies are inferred from the claim text.