US 11,629,276 B2Granted

Structural adhesive compositions

AssigneePPG Industries Ohio, Inc.

InventorsUmesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan

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Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Claims18

Dependent claims

A one-component composition comprising:

(a) 2% by weight to 40% by of an epoxy-capped flexibilizer, based on total weight of the one-component composition;
(b) 3% by weight to 25% by weight of a heat-activated latent curing agent, based on total weight of the one-component composition, wherein the heat-activated latent curing agent comprises dicyandiamide having a D98 maximum of 6 μm and a reaction product of reactants comprising a polyepoxide compound and an imidazole;
(c) optionally an epoxy/CTBN adduct;
(d) 1% by weight to 15% by weight of an epoxy-dimer acid adduct, based on total weight of the one-component composition;
(e) 5% by weight to 60% by weight of rubber particles having a core/shell structure, based on total weight of the one-component composition;
(f) optionally graphenic carbon particles;
and
an epoxy compound or an epoxy resin not incorporated into or reacted as a part of any of the components (a)-(f) and/or an epoxy carrier resin incorporated into the component (e).

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/198,504Filed 11 Mar 2021 · division
Priority: 19 Nov 2010
Published: US 2021/0198538 A11 Jul 2021
Granted: 18 Apr 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

C09J 163/00
Adhesives based on epoxy resins
B82Y 30/00
Nanotechnology for materials or surface science
C08G 59/066
Of polyhydric phenols: with chain extension or advancing agents
C08G 59/182
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react…:…

Family

Application12/949,878Parent of this continuation-in-part · filed 19 Nov 2010
Application13/315,518Parent of this continuation-in-part · filed 9 Dec 2011
Application13/918,021Parent of this continuation · filed 14 Jun 2013
Application14/961,513Parent of this division · filed 7 Dec 2015
US 2021/0198538 A1Pre-grant publication · published 1 Jul 2021
US 10,947,428 B2Parent of this division
Application14/961,513Parent of this continuation
Application13/918,021Parent of this continuation-in-part
US 2012/0128499 A1Published application
US 2012/0129980 A1Published application
US 2014/0150970 A1Published application
US 2016/0083633 A1Published application
US 11,629,276 B2This patent

From the US filing history. Foreign family members aren’t listed.