Method for formation and application of adhesive

An adhesive comprising a mixture of:

• a first component in a liquid state, the first component including a curing agent accelerator in an amount of from about 0.3% to about 0.8% by weight of the adhesive, and a liquid epoxy resin in a separate amount from about 4% to about 7% by weight of the adhesive;
• a second component in a solid state and having a pre-determined softening temperature of at least about 40° C., includes a solid epoxy resin, at least one polymeric ingredient, and a curing agent;
• wherein:
• the second component has a softening temperature below an activation temperature in order to avoid premature curing of the second component;
• and
• (ii) the first component has a viscosity of at least about 0.001 Pa·s at 23° C. as measured by a viscometer, so that the viscosity facilitates mixing of the first and a softened second component in a metered system so that a predetermined amount of the first component is mixed with a predetermined amount of the second component to define a homogeneous mixture of the adhesive;
• wherein the second component includes a blowing agent which causes the adhesive to expand.