Solder device and system controller thereof

A solder device, comprising:

• a light source emitting waveband light;
• a solder module, wherein the waveband light is guided to a to-be-soldered area by the solder module for heating to perform a solder operation;
• an optical guiding assembly disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly,
• a sensor disposed on another side of the optical guiding assembly relative to the solder module for receiving a sensing light beam and generating a sensing signal according to a sensing result of the sensing light beam, wherein the sensing light beam is guided to the sensor by the optical guiding assembly;
• and
• a feedback controller connected with the sensor and the light source for receiving the sensing signal and controlling the light source according to the sensing signal,
• wherein the solder module is a dynamic part, and the optical guiding assembly, the sensor and the feedback controller are integrated as a system controller to be a static part.