Process for electroplating an aqueous adhesive composition comprising a phosphate salt and a thermosetting resin on a conductive element

A process for the electroplating of an adhesive composition onto at least one conductive element, the process comprising:

• placing the conductive element in contact with the adhesive composition, wherein the adhesive composition comprises:
• at least one phosphate salt, and
• at least one resin based on:
• at least one compound A1 selected from the group consisting of:
• a compound A11 comprising at least two functions, one function being a hydroxymethyl function and one function being an aldehyde function or a hydroxymethyl function,
• a compound A12 comprising at least one aldehyde function, and
• a mixture of a compound A11 and of a compound A12, and
• at least one phenol A21;
• and
• applying a potential difference between the conductive element and the adhesive composition so as to coat the conductive element with an adhesive layer based on the adhesive composition.