Carrier material for vinyl floor covering
AssigneesLow & Bonar B.V., Saint-Gobain Adfors
InventorsEdze Jan Visscher, Ype Zijpp Van Der, Hans Veltman, Pepijn Kuik, Leonie Stigter, Sophie Lelogeay, Eric Daniel, Mantecon Torres Alejandro Javier
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Abstract
A carrier material for vinyl floor covering, wherein the carrier material includes a nonwoven layer containing at least 50 wt. % of thermoplastic fibers and a scrim for eliminating wrinkles in the vinyl floor covering. The scrim includes weft yarns having a linear density of 28 tex or less. The carrier material prevents the formation of surface irregularities and printing errors in the vinyl floor covering.
Claims11
A carrier material for manufacturing a composite product comprising the carrier material and an impregnated matrix, the carrier material comprising
- nonwoven layers of fibers, wherein each nonwoven layer of fibers is composed of thermoplastic fibers for at least 50 wt. % of the total weight of fibers in the respective nonwoven layer of fibers, and
- a scrim comprising weft yarns consisting of glass fibers or consisting of high modulus polyester fibers, the weft yarns of glass fibers having a linear density of 28 tex or less, the weft yarns of high modulus polyester fibers having a linear density of 50 tex or less, and the weft yarns having a modulus of at least 25 GPa,
- wherein the scrim is embedded between two of the nonwoven layers of fibers, the scrim being located in between the two nonwoven layers of fibers, and the two nonwoven layers of fibers being directly bonded to each other only through openings in the scrim, integrating the warp and the weft yarns of the scrim into the carrier material by encapsulation by the fibers from the two nonwoven layers of fibers that are bonded to each other, and
- wherein the scrim and the nonwoven layers of fibers are connected to each other by bonding that consists of only thermal bonding achieved through use of hot air to form an integrated carrier material.
Dependencies are inferred from the claim text.