Component carrier and method of manufacturing the same

A method of manufacturing a component carrier, the method comprising the following steps:

• providing a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure;
• partially removing the first electrically conductive layer structure to obtain at least one first covered portion, where the first electrically insulating layer structure is covered by the first electrically conductive layer structure, and at least one first non-covered portion, where the first electrically insulating layer structure is not covered by the first electrically conductive layer structure;
• and
• forming a recess in the first electrically insulating layer structure at the at least one first non-covered portion, wherein:
• the stack further comprises a second electrically insulating layer structure and a second electrically conductive layer structure arranged on the second electrically insulating layer structure opposite to the first electrically conductive layer structure, wherein the method further comprises:
• partially removing the second electrically conductive layer structure to obtain at least one second covered portion, where the second electrically insulating layer structure is covered by the second electrically conductive layer structure, and at least one second non-covered portion, where the second electrically insulating layer structure is not covered by the second electrically conductive layer structure;
• arranging a first further electrically insulating layer structure on the first electrically conductive layer structure;
• arranging a second further electrically insulating layer structure on the second electrically conductive layer structure;
• and
• a thickness of the first further electrically insulating layer structure at the first non-covered portion is not equal to a thickness of the second further electrically insulating layer structure at the second non-covered portion;
• wherein the first further electrically insulating layer structure fills the recess in the first electrically insulating layer structure.

A component carrier, comprising:

• a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure, wherein
• the first electrically insulating layer structure comprises at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure;
• and
• the first electrically insulating layer structure comprises a recess at the at least one first non-covered portion;
• wherein:
• the stack further comprises a second electrically insulating layer structure and a second electrically conductive layer structure arranged on the second electrically insulating layer structure opposite to the first electrically conductive layer structure,
• the second electrically insulating layer structure comprises at least one second covered portion, which is covered by the second electrically conductive layer structure, and
• at least one second non-covered portion, which is not covered by the second electrically conductive layer structure;
• the component carrier further comprises a first further electrically insulating layer structure arranged on the first electrically conductive layer structure and a second further electrically insulating layer structure arranged on the second electrically conductive layer structure;
• and
• a thickness of the first further electrically insulating layer structure at the first noncovered portion is not equal to a thickness of the second further electrically insulating layer structure at the second non-covered portion;
• wherein the first electrically insulating layer structure comprises a plurality of first noncovered portions which are not covered by the first electrically conductive layer structure;
• and
• wherein the first electrically insulating layer structure comprises at least one first non-covered portion of the plurality of first non-covered portions, where the recess is not formed;
• wherein the component carrier comprises at least a part of a power section and at least a part of a control section, wherein the control section is configured to control the power section;
• wherein the power section and the control section are at least partly formed by the first electrically conductive layer structure;
• and
• wherein the control section comprises the recess, and the power section comprises the at least one first non-covered portion of the plurality of first non-covered portions, where the recess is not formed.