Dual-sided molding for encapsulating electronic devices

A molding system for molding electronic components mounted on opposite first and second sides of a substrate, the molding system comprising:

• a molding cavity onto which the substrate is locatable, the molding cavity having a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate;
• a first plunger located in a first pot for compressing molding compound placed in the first pot, and a second plunger located in a second pot for compressing molding compound placed in the second pot;
• a first runner connecting the first pot to the first section of the molding cavity for introducing the molding compound onto the first side of the substrate;
• and
• a second runner connecting the second pot to the second section of the molding cavity for introducing the molding compound onto the second side of the substrate;
• wherein the first runner extends at least from a first edge of the substrate along the first side of the substrate to the first section of the molding cavity, and the second runner extends at least from a second edge of the substrate, located directly opposite the first edge on the first side of the substrate, along the second side of the substrate to the second section of the molding cavity.