Acoustic wave devices on stacked die
AssigneeSkyworks Solutions, Inc.
InventorsHiroyuki Nakamura, Rei Goto, Keiichi Maki
Life of this patent
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Abstract
Aspects of this disclosure relate to acoustic wave devices on stacked die. A first die can include first acoustic wave device configured to generate a boundary acoustic wave. A second die can include a second acoustic wave device configured to generate a second boundary acoustic wave, in which the second die is stacked with the first die. The first acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer. The high acoustic velocity layers can each have an acoustic velocity that is greater than a velocity of the boundary acoustic wave.
Claims21
An acoustic wave device assembly comprising:
- a first die including a first acoustic wave device configured to generate a boundary acoustic wave, the first acoustic wave device including a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer, the high acoustic velocity layers each having an acoustic velocity that is greater than a velocity of the boundary acoustic wave;
- a second die stacked with the first die, the second die including a second acoustic wave device configured to generate a second boundary acoustic wave;
- and
- a dielectric layer disposed between the first die and the second die.
An acoustic wave device assembly comprising:
- a first die including a first acoustic wave device configured to generate a boundary acoustic wave, the first acoustic wave device including a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer, the high acoustic velocity layers each having an acoustic velocity that is greater than a velocity of the boundary acoustic wave;
- a second die stacked with the first die, the second die including a second acoustic wave device configured to generate a second boundary acoustic wave;
- and
- an air gap between the first die and the second die.
A radio frequency module with acoustic wave filters, the radio frequency module comprising:
- a first acoustic wave filter configured to filter a first radio frequency signal, the first acoustic wave filter including a first acoustic wave device on a first die and configured to generate a boundary acoustic wave, the first acoustic wave device including a piezoelectric layer and high acoustic velocity layers on opposing sides of the piezoelectric layer, the high acoustic velocity layers each having an acoustic velocity that is greater than a velocity of the boundary acoustic wave;
- a second acoustic wave filter configured to filter a second radio frequency signal, the second acoustic wave filter including a second acoustic wave device on a second die and configured to generate a second boundary acoustic wave, the second die being stacked with the first die;
- and
- a package enclosing the first acoustic wave filter and the second acoustic wave filter, the radio frequency module having a thickness that is less than 300 micrometers.
Dependencies are inferred from the claim text.