Acoustic wave device and electronic component module
AssigneeMurata Manufacturing Co., Ltd.
InventorsMunehisa Watanabe, Hideki Iwamoto
Life of this patent
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Abstract
An acoustic wave device includes a support substrate, a piezoelectric body layer, an interdigital transducer electrode, and an external connection electrode. The piezoelectric body layer is on the support substrate. The interdigital transducer electrode is on the piezoelectric body layer. The external connection electrode is electrically connected to the interdigital transducer electrode. The external connection electrode does not overlap the piezoelectric body layer in a plan view from a thickness direction of the support substrate. The support substrate includes a hollow portion. The hollow portion is at least on an end portion of the support substrate in a plan view from the thickness direction.
Claims20
An acoustic wave device comprising:
- a support substrate;
- a piezoelectric body layer on or above the support substrate;
- an interdigital transducer electrode on or above the piezoelectric body layer;
- and
- an external connection electrode electrically connected to the interdigital transducer electrode;
- wherein
- the external connection electrode does not overlap the piezoelectric body layer in a plan view from a thickness direction of the support substrate;
- the support substrate includes a hollow portion at least on an end portion of the support substrate in the plan view from the thickness direction;
- and
- the hollow portion does not extend to a portion overlapping the interdigital transducer electrode in the plan view from the thickness direction.
Dependencies are inferred from the claim text.