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US 11,616,148 B2Granted
Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor device
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsMiki Miyanaga, Kenichi Watatani, Hideaki Awata
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Abstract
The present invention relates to an oxide sintered material that can be used suitably as a sputtering target for forming an oxide semiconductor film using a sputtering method, a method of producing the oxide sintered material, a sputtering target including the oxide sintered material, and a method of producing a semiconductor device 10 including an oxide semiconductor film 14 formed using the oxide sintered material.
Claims12
An oxide sintered material containing indium, tungsten, and zinc, the oxide sintered material comprising:
- a first crystal phase that is a main component of the oxide sintered material and includes a bixbyite type crystal phase;
- and
- a second crystal phase having a content of the zinc higher than a content of the zinc in the first crystal phase, wherein
- the second crystal phase includes particles having an average major axis size of more than or equal to 3 μm and less than or equal to 50 μm and having an average aspect ratio of more than or equal to 1.5 and less than or equal to 50,
- the oxide sintered material has an apparent density of more than 6.4 g/cm3 and less than or equal to 7.5 g/cm3,
- a content of the tungsten relative to a total of the indium, the tungsten, and the zinc in the oxide sintered material is more than 0.01 atom % and not more than 0.5 atom %,
- a content of the zinc relative to the total of the indium, the tungsten, and the zinc in the oxide sintered material is more than or equal to 1.2 atom % and less than 50 atom %, and
- an atomic ratio of the zinc to the tungsten in the oxide sintered material is more than 1.0 and less than 20000.
5 more elements
Dependencies are inferred from the claim text.