Fab management with dynamic sampling plans, optimized wafer measurement paths and optimized wafer transport, using quantum computing

A system for optimizing wafer transport and metrology measurements in a semiconductor fabrication plant (fab), the system comprising:

• at least one processor configured to:
• derive and update dynamic sampling plans that provide wafer-specific measurement sites and conditions, wherein the dynamic sampling plans differ between wafers, and
• manage Front Opening Unified Pod (FOUP) transport through the fab, transporting wafers to measurement tools while providing the dynamic sampling plans to the respective measurement tools before or as the FOUPs with the respective wafers are transported thereto, wherein the measurement tools are metrology tools or inspection tools,
• wherein the respective measurement tools are configured to carry out metrology and/or inspection measurements of the respective wafers according to the provided dynamic sampling plans, and wherein the processor comprises at least one quantum computer.

A system for optimizing wafer transport and metrology measurements in a semiconductor fabrication plant (fab), the system comprising:

• at least one processor configured to:
• derive optimized wafer measurement paths for metrology measurements of the wafers according to dynamic sampling plans that provide wafer-specific measurement sites and conditions and differ between wafers, and
• manage Front Opening Unified Pod (FOUP) transport through the fab, transporting wafers to measurement tools while providing the derived wafer measurement paths to the respective measurement tools before or as the FOUPs with the respective wafers are transported thereto, wherein the measurement tools are metrology tools or inspection tools,
• wherein the respective measurement tools are configured to carry out metrology and/or inspection measurements of the respective wafers according to the derived wafer measurement paths, and wherein the processor comprises at least one quantum computer.