System and method for producing a strip of material with an integrated electronic component
AssigneeTexmag GmbH Vertriebsgesellschaft
InventorJens-Oliver Adam
Life of this patent
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Abstract
The method for producing a strip of material with an integrated electronic component comprises the following steps according to the present invention: feeding a material web, cutting a first piece of material from the material web, lifting the first piece of material, applying an electronic component to the material web, once again feeding the material web with the electronic component located on it, cutting a piece of material from the material web to obtain a second piece of material on which the electronic component is located, and applying the first piece of material to the second piece of material so that the electronic component is accommodated between the first piece of material and the second piece of material.
Claims13
A method for producing a strip of material with an integrated electronic component, comprising:
- feeding a material web of unvulcanized rubber;
- cutting a first piece of unvulcanized rubber from the material web;
- applying an RFID chip to the material web;
- positioning the first piece of unvulcanized rubber with respect to the RFID chip;
- cutting a second piece of unvulcanized rubber from the material web on which the RFID chip is located wherein the first piece and the second piece of unvulcanized rubber are completely separated from the material web after cutting;
- and
- applying the first piece of unvulcanized rubber to the second piece of unvulcanized rubber so that the RFID chip is disposed between the first piece of unvulcanized rubber and the second piece of unvulcanized rubber.
A method, comprising:
- cutting a first piece of unvulcanized rubber from a material web wherein the first piece of unvulcanized rubber is completely separated from the material web;
- cutting a second piece of unvulcanized rubber from the material web, wherein the second piece of unvulcanized rubber is completely separated from the material web and separate from the first piece of unvulcanized rubber;
- positioning the first piece of unvulcanized rubber at a different position;
- transferring an RFID chip from a feeding device;
- placing the RFID chip on the second piece of;
- and
- applying the first piece of unvulcanized rubber to the second piece of unvulcanized rubber such that the RFID chip is disposed between the first piece of unvulcanized rubber and the second piece of unvulcanized rubber.
A method, comprising:
- cutting a first piece of unvulcanized rubber from a material web wherein the first piece of unvulcanized rubber is completely separated from the material web;
- lifting the first piece of unvulcanized rubber;
- cutting a second piece of unvulcanized rubber material from the material web wherein the second piece of unvulcanized rubber is completely separated from the material web;
- positioning the first piece of unvulcanized rubber at a different location;
- obtaining an RFID chip from a feeding device;
- lifting the second piece of unvulcanized rubber;
- positioning the RFID chip on the first piece of unvulcanized rubber;
- positioning the second piece of unvulcanized rubber over the RFID chip;
- and
- connecting the first piece of unvulcanized rubber and the second piece of unvulcanized rubber to one another to hold the RFID chip between the first piece of unvulcanized rubber and the second piece of unvulcanized rubber.
Dependencies are inferred from the claim text.