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US 11,610,801 B2Granted
Laser-releasable bonding materials for 3-D IC applications
AssigneeBrewer Science Inc.
InventorsLuke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu
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Abstract
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
Claims9
A temporary bonding method comprising:
- providing a stack comprising:
- a first substrate having a back surface and a front surface;
- a bonding layer adjacent said front surface;
- a second substrate having a first surface;
- and
- a release layer between said first surface and said bonding layer, said release layer comprising a polyketanil;
- and
- exposing said release layer to laser energy so as to facilitate separation of said first and second substrates.
5 more elements
Dependencies are inferred from the claim text.