Diffusion barrier for implantable electrode leads
AssigneeBIOTRONIK SE & Co. KG
InventorsEckardt Bihler, Marc Hauer
Life of this patent
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Abstract
A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.
Claims15
A process for producing an electrical conductor structure comprising:
- embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and
- producing an electric current in the at least one heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the at least one heating conductor, to seal an interface between the first layer and the second layer and seal the at least one metallic conductor track therebetween,
- wherein the at least one metallic conductor track is separate from and not connected to the at least one heating conductor.
A process for producing an electrical conductor structure comprising:
- embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and
- producing an electric current in the at least one heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the at least one heating conductor, to seal an interface between the first layer and the second layer,
- wherein the electrical conductor structure is an implantable electrode lead.
A conductor structure comprising:
- at least one metallic conductor track, and
- at least one heating conductor, the at least one conductor track and the at least one heating conductor being embedded in an electrically insulating substrate, and a first layer of the substrate being fused with a second layer of the substrate or being fusible with a second layer of the substrate by means of the at least one heating conductor in an area surrounding the at least one heating conductor, to seal an interface between the first layer and the second layer of the conductor structure and seal the at least one metallic conductor track therebetween,
- wherein the at least one metallic conductor track is separate from and not connected to the at least one heating conductor.
Dependencies are inferred from the claim text.