Sputtering apparatus
AssigneeTokyo Electron Limited
InventorManabu Nakagawasai
Life of this patent
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Abstract
A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.
Claims13
A sputtering apparatus comprising:
- a base on which a substrate is placed;
- an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without being in contact with the substrate;
- and
- an edge cover that covers an outer edge of an upper surface of the substrate placed on the base,
- wherein the annular member has:
- a first surface facing the backside of the substrate placed on the base with a gap between the first surface and the substrate,
- a second surface facing the side surface of the substrate placed on the base with a gap between the second surface and the substrate, and
- a tapered surface formed at a corner portion between the first surface and the second surface,
- wherein the second surface extends from an upper end of the tapered surface, and
- wherein the upper end of the tapered surface is formed at a position higher than the first surface.
Dependencies are inferred from the claim text.