Coloured glazing and method for obtaining same

A process for depositing a layer of a material having a plasmon absorption peak whose maximum is in a range of from 350 to 800 nm onto a glass substrate, the process comprising:

• (a) passing the substrate into a cathode sputtering vacuum deposition device;
• (b) introducing a plasma-generating gas into the vacuum deposition device and generating a plasma from the gas;
• (c) simultaneously sputtering in the same chamber of the vacuum deposition device:
• a first target comprising an oxide comprising titanium, silicon, and/or zirconium,
• a second target comprising (i) an oxide comprising titanium, silicon, and/or zirconium and (ii) metal nanoparticles comprising silver, gold, platinum, copper, and/or nickel metal the second target having an M/Me atomic ratio of less than 1.5, M representing all atoms of titanium, silicon, and zirconium, and Me representing all atoms of silver, gold, platinum, copper, and/or nickel metal, the sputtering being obtained by the plasma;
• and
• (d) recovering a glazing comprising the substrate covered with the layer, the layer comprising the metal nanoparticles dispersed in an inorganic matrix of the oxide and having a plasmon absorption peak in the visible range,
• or
• (d′) recovering a glazing comprising the substrate covered with the layer, at least the layer being heat-treated, under conditions suitable for obtaining a layer comprising the metal nanoparticles dispersed in the inorganic matrix of the oxide and having a plasmon absorption peak in the visible range,
• wherein the metal nanoparticles are distributed in the layer in an increasing concentration gradient, from each surface of the layer to the center of said layer, the concentration of metal nanoparticles being at a maximum at the center of the layer,
• wherein the layer has an M/Me atomic ratio of less than 1.5.

A process for depositing a layer of a material having a plasmon absorption peak whose maximum is in a range of from 350 to 800 nm onto a glass substrate, the process comprising:

• (a) passing the substrate into a cathode sputtering vacuum deposition device;
• (b) introducing a plasma-generating gas into the vacuum deposition device and generating a plasma from the gas, in the presence of oxygen;
• (c) sputtering a target in a chamber of the device, the target comprising (i) an oxide comprising titanium, silicon, and/or zirconium, and (ii) particles comprising silver, gold, platinum, copper, and/or nickel metal, the target having an M/Me atomic ratio of less than 1.5, M representing all atoms of titanium, silicon, and zirconium, and Me representing all atoms of silver, gold, platinum, copper, and nickel, the sputtering being obtained using the plasma;
• and
• (d) recovering a glazing comprising the substrate covered with the layer, the layer comprising the metal nanoparticles dispersed in an inorganic matrix of the oxide and having a plasmon absorption peak in the visible range,
• or
• (d′) recovering a glazing comprising the substrate covered with the layer, and at least the layer being heat-treated, under conditions suitable for obtaining the layer comprising the metal nanoparticles dispersed in the inorganic matrix of the oxide and having a plasmon absorption peak in the visible range,
• wherein the metal nanoparticles are distributed in the layer in an increasing concentration gradient, from each surface of the layer to a center of the layer, the concentration of metal nanoparticles being at a maximum at the center of the layer.