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US 11,607,753 B2Granted
Solder alloy, cast article, formed article, and solder joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsShunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Naoko Izumita, Yuuki Iijima, Kanta Dei
Life of this patent
Estimating the term…
Abstract
A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.
Claims8
A solder alloy, having an alloy composition consisting of, in mass %:
- Cu:
- 0.1% to 0.6%;
- Ni:
- 0.01% to 0.4%;
- P:
- 0.001% to 0.08%;
- Ge:
- 0.001% to 0.08%;
- and
- optionally at least one selected from the group consisting of Mn, Cr, Co, Si, Ti, and rare earth elements in a total amount of 1% or less,
- with the balance being Sn, wherein
- the alloy composition satisfies the following relations (1) to (3):
- (
- C
-
-
- u
- +
- 5
-
- N
-
-
- i
- )
- ≤
- 0.945
-
- %
- Relation
-
-
- (
- 1
- )
- (
- P
- +
- G
-
-
- e
- )
- ≤
- 0.15
-
- %
- Relation
-
-
- (
- 2
- )
- 2.0
- ≤
- (
- C
-
-
- u
- +
- 5
-
- N
-
-
- i
- )
- /
- (
- P
- +
- G
-
-
- e
- )
- ≤
- 1000
- Relation
-
-
- (
- 3
- )
- wherein, in the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content in mass % thereof in the solder alloy, and
- when the solder alloy is used to produce a bar solder having a width of 10 mm and a length of 300 mm, the thickness of the bar solder is within a range of 7 mm±1 mm.
84 more elements
Dependencies are inferred from the claim text.