Semiconductor chip bonding apparatus including head having thermally conductive materials

A semiconductor chip bonding apparatus comprising:

• a body;
• a heater disposed on a lower surface of the body;
• a collet disposed on a lower surface of the heater, the collet having a plate shape;
• and
• a head disposed on a lower surface of the collet,
• wherein the head is a rectangular plate,
• wherein a side surface of the head is exposed,
• wherein an area of the upper surface of the head is smaller than an area of the lower surface of the collet,
• wherein the collet comprises:
• a central vacuum channel extending vertically through the collet, and
• an outer vacuum channel communicating with the central vacuum channel and extending to the lower surface of the collet,
• wherein the head comprises:
• a central section having a circular, oval or rectangular shape when viewed from a top side, the central section comprising a thermally conductive material, and
• a peripheral section disposed to surround an outer surface of the central section, a thermal conductivity of a material of the peripheral section being different from a thermal conductivity of a material of the central section,
• wherein the central section comprises a through hole configured to communicate with the central vacuum channel and extends through the head in a thickness direction of the head, and
• wherein an area of an upper surface of the peripheral section is equal to 40 to 60% of an area of an upper surface of the head.

A semiconductor chip bonding apparatus comprising:

• a body;
• a heater disposed on a lower surface of the body;
• a collet disposed on a lower surface of the heater;
• and
• a head disposed on a lower surface of the collet, the head having a lower surface disposed at a level that is lower than the lower surface of the collet,
• wherein the head is a rectangular plate,
• wherein an area of an upper surface of the head is smaller than an area of a lower surface of the collet,
• wherein the head comprises:
• a central section comprising a through hole extending through the head in a thickness direction of the head, and
• a peripheral section connected to an edge of the central section,
• wherein the peripheral section comprises a first peripheral section, a second peripheral section, a third peripheral section, and a fourth peripheral section that are respectively spaced apart from one another by the central section,
• wherein an area of an upper surface of the peripheral section is equal to 40 to 60% of an area of the upper surface of the head, and
• wherein a thermal conductivity of a material of the peripheral section is higher than a thermal conductivity of a material of the central section.