Food service apparatus with peltier heating and cooling systems

A system for heating and cooling food, the system comprising:

• a support structure including at least one tray receiving well;
• at least a first temperature adjustment system corresponding to the at least one well, the at least first temperature adjustment system comprising:
• a first manifold having a plurality of openings, with a seat formed around each opening to seal against a first surface of a Peltier chip, the first manifold and the first surface of the Peltier chip partially defining a first flow path for a heat transfer fluid which directly contacts the first surface of the Peltier chip, the flow path comprising a channel which includes one or more baffles having a height of from about ⅓ to about ⅔ the depth of the opening for creating turbulent flow to increase the contact of the heat transfer fluid with the first surface of the Peltier chip, and the first manifold in operative connection to tubing accessible in the at least one well such that temperature adjusted fluid circulates from the at least manifold to the at least one well to the tray received therein and returns from the at least one well to the first manifold in a first loop,
• a second opposite manifold attached to the first manifold to form an at least a first manifold block, the second opposite manifold having a corresponding plurality of openings, each allowing a seal to be made against a second surface of the Peltier chip to define a second flow path for a heat transfer fluid which directly contacts the second surface of the Peltier chip, the second opposite manifold in operative connection to a radiator such that the heat transfer fluid circulates from the second opposite manifold to the radiator in a second loop, and
• at least one pump for circulating the heat transfer fluid, such that application of electrical current in a first direction to the plurality of Peltier chips heats the fluid in the first loop to increase the temperature in the first loop and application of electrical current in a second direction to the plurality of Peltier chips cools the fluid in the first loop to decrease the temperature in the first loop;
• and
• a double walled tray disposed in the at least one tray receiving well and in operative connection with the temperature adjustment system by attachment of at least a first inflow port and at least a first outflow port to the tubing in communication with the at least first manifold, the double walled tray having sidewalls surrounding a generally planar bottom, and including a flow path defined by continuous ridges disposed between the double walls that define channels that direct the flow of the heat transfer fluid around the flow space horizontally across the bottom of the double walled tray and vertically along the sidewalls of the double walled tray, wherein the continuous ridges extend horizontally across the bottom of the double walled tray and vertically along a majority of the height of two opposite sidewalls of the double walled tray.