Electronic device having electronic components with different temperature specifications

An electronic device, comprising:

• a housing, forming a receiving space;
• a first circuit board, received in the receiving space and erected along a gravity direction, the first circuit board including a first electronic component and a second electronic component disposed on one side of the first circuit board, a temperature specification of the first electronic component is higher than that of the second electronic component, a position of the first electronic component along the gravity direction is higher than a position of the second electronic component along the gravity direction;
• and
• a first heat sink, received in the receiving space along the gravity direction, the first heat sink including a first base board extended along the gravity direction and at least one first side board extended along the gravity direction, the first base board being arranged adjacent to the first circuit board, at least one of the first and the second electronic components conducting heat to the first base board, the at least one first side board connected to the first base board, the first base board and the at least one first side board forming a first heat dissipating channel along the gravity direction and parallel to the first circuit board, the first electronic component and the second electronic component being arranged outside the first heat dissipating channel, the at least one side board being close to or contacting the housing so as to dissipate the heat of the first and second electronic components by heat conduction and heat convection.