Method for forming channels in printed circuit boards by stacking slotted layers

A process of fabricating an electromagnetic circuit, the process comprising:

• providing three laminate sheets, each laminate sheet including a flat sheet of dielectric material having a layer of copper applied to the sheet, the copper layer being formed into conductive lines and traces, including pads and vias;
• forming at least one first feature in a first laminate sheet of the three laminate sheets, the at least one first feature being a slot or channel;
• forming at least one second feature in a second laminate sheet of the three laminate sheets, the at least one second feature being a slot or channel, the at least one second feature being aligned with the first feature when aligning the second laminate sheet with the first laminate sheet;
• after forming the at least one first feature in the first laminate sheet and the at least one second feature in the second laminate sheet, stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with a third laminate sheet, the at least one first feature and the at least one second feature defining a contiguous element;
• and
• after stacking the three laminate sheets, filling the contiguous element with an electrically conductive material to form an electrically continuous conductor, the electrically continuous conductor creating a Faraday wall.