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US 11,606,864 B2Granted
System for creating interconnections between a substrate and electronic components
AssigneeSunRay Scientific, Inc.
InventorAndrew Stemmermann
Life of this patent
Estimating the term…
Abstract
Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
Claims7
A system for creating interconnects between a substrate and electronic components attached thereto using a magnetically-alignable anisotropic conductive adhesive (ACA), the system comprising
- a magnet tray comprising a nonmagnetic tray adapted to receive and retain each of one or more magnets placed therein in a location that corresponds to the location of one or more electronic components on the substrate to which the components are to be connected;
- an alignment tray adapted to retain the substrate populated with one or more components to be connected thereto with an ACA during alignment and curing of the ACA;
- and the ACA comprising magnetically-alignable particles capable of forming interconnections conductive in the Z-axis;
- wherein the alignment tray and the magnetic tray are made of nonmagnetic material;
- wherein the magnet tray and the alignment tray are arranged together vertically in removable fashion such that the components on the substrate are vertically aligned with the magnets in the magnet tray and the ACA is exposed to the magnetic field such that the flux lines are substantially perpendicular to an X-Y plane defining the substrate;
- and
- wherein the substrate can only be placed in the alignment tray in one orientation.
4 more elements
Dependencies are inferred from the claim text.