Methods for producing an etch resist pattern on a metallic surface
AssigneeKateeva, Inc.
InventorsMoshe Frenkel, Nava Shpaisman
Life of this patent
Estimating the term…
Abstract
Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
Claims19
A method comprising:
- depositing a first aqueous composition comprising a first reactive component comprising a reactive polymer, a long-chain quaternary amine, or a metal cation directly onto a metallic layer of a substrate;
- printing, in a pattern, a second aqueous composition comprising a second reactive component comprising an anionic material on selected portions of the deposited first aqueous composition to form a patterned bi-component material mask to protect selected regions of the metallic layer, wherein the second reactive component chemically reacts with the first reactive component upon contact and immobilizes the second aqueous composition;
- and
- depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
Dependencies are inferred from the claim text.