Circuit board, method for manufacturing the same
AssigneesAvary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Garuda Technology Co., Ltd.
InventorsPo-Yuan Chen, Yong-Chao Wei
Life of this patent
Estimating the term…
Abstract
A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.
Claims9
A circuit board comprising:
- a circuit substrate;
- at least one metal pad;
- and
- a tin bar corresponding to each of the at least one metal pad;
- wherein each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate, a recess recessed toward the circuit substrate is defined on a surface of each of the metal pad facing away from the circuit substrate, and the tin bar is received in the recess, a height of the tin bar is less than a depth of the recess or a surface of the tin bar facing away from the circuit substrate is flush with the surface of the metal pad facing away from the circuit substrate.
A method for manufacturing a circuit board comprising:
- providing a single-sided metal-clad laminate comprising an insulating layer and a metal foil formed on a side of the insulating layer;
- pressing a first photosensitive film on a side of the metal foil facing away from the insulating layer, and exposing and etching the first photosensitive film to form at least one first groove, wherein a portion of the metal foil is exposed from the at least one first groove;
- forming a tin bar in each of the at least one first groove by plating tin, and removing the first photosensitive film;
- pressing a second photosensitive film on the side of the metal foil facing away from the insulating layer, wherein the tin bar is covered by the second photosensitive film;
- exposing and etching the second photosensitive film to form a second groove corresponding each of the tin bar, wherein the tin bar is exposed from the second groove, and the tin bar is spaced from the exposed and etched second photosensitive film;
- forming a metal pad in the second groove by plating metal, wherein the metal pad fills between the tin bar and the second photosensitive film, the metal pad covers the tin bar thereby forming a recess to wrap the tin bar;
- forming a circuit substrate on a side of the second photosensitive film facing away from the single-sided metal-clad laminate to be connected to metal pad;
- and
- removing the single-sided metal-clad laminate and the second photosensitive film on the circuit substrate.
Dependencies are inferred from the claim text.