Printed wiring board

A printed wiring board, comprising:

• a first resin insulating layer;
• a conductor layer formed on a surface of the first resin insulating layer;
• and
• a second resin insulating layer formed on the surface of the first resin insulating layer such that the second resin insulating layer is covering the conductor layer,
• wherein the conductor layer includes a first conductor circuit having a first width of 15 μm or less and a substantially rectangular cross-sectional shape, a second conductor circuit having a second width and a substantially trapezoidal cross-sectional shape, a third conductor circuit positioned on a first side of the first conductor circuit, a fourth conductor circuit positioned on a second side of the first conductor circuit on an opposite side with respect to the first side, a fifth conductor circuit positioned on a first side of the second conductor circuit, and a sixth conductor circuit positioned on a second side of the second conductor circuit on an opposite side with respect to the first side of the second conductor circuit, the first and third conductor circuits are positioned to have a third space formed between the first and third conductor circuits such that the third space has a third width of 14 μm or less, the first and fourth conductor circuits are positioned to have a fourth space formed between the first and fourth conductor circuits such that the fourth space has a fourth width of 14 μm or less, the second and fifth conductor circuits are positioned to have a fifth space formed between the second and fifth conductor circuits such that the fifth space has a fifth width of 20 μm or more, and the second and sixth conductor circuits are positioned to have a sixth space formed between the second and sixth conductor circuits such that the sixth space has a sixth width of 20 μm or more.