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US 11,606,108 B2Granted
Radio frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoichi Sawada, Takayuki Shinozaki
Life of this patent
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Abstract
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.
Claims23
A radio frequency module, comprising:
- a module board that includes a first principal surface and a second principal surface on opposite sides of the module board;
- a transmission input terminal;
- a reception output terminal;
- an antenna connection terminal;
- a power amplifier connected between the transmission input terminal and the antenna connection terminal and configured to amplify a transmission signal;
- a low noise amplifier connected between the reception output terminal and the antenna connection terminal and configured to amplify a reception signal;
- a first switch connected between the transmission input terminal and the power amplifier;
- and
- a control circuit configured to control the power amplifier, wherein
- the power amplifier and the control circuit are stacked on the first principal surface, and
- the low noise amplifier is disposed on the second principal surface.
8 more elements
Dependencies are inferred from the claim text.