Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsSheng-Chi Hsieh, Chen-Chao Wang, Teck-Chong Lee, Chien-Hua Chen
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Abstract
A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
Claims20
A semiconductor device package, comprising:
- a carrier having a first side and a second side opposite to the first side;
- an interconnection layer disposed over the first side of the carrier;
- and
- a first antenna layer disposed under the second side of the carrier and electrically connected to the interconnection layer;
- wherein the carrier includes a transparent material and the carrier is configured to facilitate an alignment between the first antenna layer and the interconnection layer.
A semiconductor device package, comprising:
- a transparent carrier having a bottom surface, a top surface opposite to the bottom surface, and a first lateral surface extending between the top surface and the bottom surface;
- a first antenna in contact with the transparent carrier;
- and
- a dipole antenna in contact with the transparent carrier.
Dependencies are inferred from the claim text.